• TOPICS


    Papers are requested on the following topics:

  • ► A - Quality and Reliability assessment techniques and methods for Devices and Systems

     
    • Design for reliability, Built-in reliability,
    • Virtual qualification, Reliability simulation,
    • Advanced models for Reliability prediction,
    • Reliability test structures, Limits to accelerated tests,
    • Screening methods, Yield/reliability relationship,
    • Obsolescence, Counterfeit.

  • ► B - Semiconductor Failure Mechanisms & Reliability for Si technologies & Nanoelectronics

     
    • Process-related issues, Passivation stability,
    • Hot carriers injection, NBTI, TDDB,
    • High-K dielectrics and gate stacks,
    • Low-K dielectrics and Cu interconnects,
    • Metal migration: mechanical and thermal aspects,
    • Non-volatile and programmable cells,
    • Silicon on Insulator devices,
    • Nano-electronics, Nano-electronic materials for solid state devices.

  • ► C - Progress in Failure Analysis: Defect Detection and Analysis

     
    • Electron, ion and optical beam techniques,
    • Scanning probe techniques,
    • Static or dynamic techniques, Backside techniques,
    • Acoustic microscopy,
    • Electric or magnetic field based techniques,
    • Electrical, thermal and thermo-mechanical characterization,
    • Sample preparation, construction analysis,
    • Failure analysis: case studies.

  • ► D - Reliability of Microwave devices and circuits

     
    • Wide band gap semiconductors,
    • Microwave and compound semiconductor devices,

  • ► E - Packaging and Assembly : Reliability and Failure Analysis

     
    • Electrical Modeling & Simulations,
    • Mechanical Modeling & Simulations,
    • 3D / TSV, Flip chip, Advanced substrates,Chip/package interaction.

  • ► F - Power Devices and Microelectronic System: Reliability and Failure Analysis


    • Smart-Power Devices,
    • Silicon Power Devices,
    • Wide-Bandgap Devices
    • Power Electronic System

  • ► G - Photonics Reliability

     
    • Solar Cells and Display,
    • Optoelectronics,
    • Organic electronics: OLED, Electronic Ink, TFT

  • ► H - MEMS and sensors Reliability

     
    • Bio-electronics, Bio-sensors, Nano-Bio-technologies,
    • MEMS and MOEMS,NEMS and nano-objects.

  • ► I - Extreme environments

     
    • I1 - ESD and EMC (including EOS/Latchup on integrated circuits, EMC and EMI in integrated circuits and power electronic systems)
    • I2 - Radiation (Radiation impact on circuits and systems reliability)
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